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Photovoltaics--A Ray of Light for the PCB Industry, or a Bad Cell Connection?
"While there are many different technologies used to fabricate solar cells, a good percentage of the market is basically similar to the circuit board industry. You metallize, you image, you etch, you plate." – Michael Carano, OMG Electronic Chemicals

Email mike.carano@omgi.com

Dairy Field Reports
Digital Edition Archives

CPCA Market Commentary | - July 14, 2008
Clyde Has Done It Again: Review of Printed Circuits Handbook, Sixth Edition | - July 1, 2008
Screen Printing Process for High Density Flexible Electronics Must be a registered user to see this item | - April 9, 2008
Tech Talk: Fine Lines in High Yield (Part CLV) Advances in Copper Plating (Part B) Must be a registered user to see this item
Last month’s Tech Talk covered several advances in copper plating, including environmental advances, and new applications such as copper pillar plating on wafers. But the focus was on bottom-up via fill processes for plating microvias shut and the metallization of through silicon vias.

by Karl Dietz

Fein Lines: Photovoltaics: Perhaps the Best Opportunity Since Plated Through-Hole
What are the topics you hear most about, well, besides the Hillary/Obama soap opera? They are dependence on foreign oil, price of oil, greenhouse gasses, and global warming.

by Dan Feinberg


Viruses and spam and spyware—oh my!
by Stephanie J. Church | August 13, 2008 | Comments (3)

Are we having fun yet?
by Mark Finstad | August 21, 2008 | Comments (2)

ENVISION® HDI Direct Metallization System
Increase your board capacity. Eliminate Electroless Copper.

 • Creating Connections Between Electronics Design and Manufacturing
 • Tech Talk: Fine Lines in High Yield (Part CLV) Advances in Copper Plating (Part B)
 • Fein Lines: Photovoltaics: Perhaps the Best Opportunity Since Plated Through-Hole

Buyers Guide
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Most Emailed Articles
  1. Tech Talk: Fine Lines in High Yield (Part CLIV) Advances in Copper Plating (Part A)
  2. 10 Keys to an Effective Bonus Plan in a PWB Shop
  3. New Final Finish Candidate for IC Packages
  4. Fein Lines: Photovoltaics: Perhaps the Best Opportunity Since Plated Through-Hole
  5. New Final Finish Candidate for IC Packages
  6. European PCB Market Trends
  7. AT&S Celebrates Groundbreaking of New Plant in India
  8. Chason, Hickman, and Weiner Form Quantum Solar Group
  9. Fein Lines: Photovoltaics: Perhaps the Best Opportunity Since Plated Through-Hole
  10. New Final Finish Candidate for IC Packages
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  6. Creating Connections Between Electronics Design and Manufacturing 08/01/2008
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